 DMS Lab Limited
Development of Technologies and Design Kits, foundry manufacture of wafers and devices
Engineering Services
• Development of the specifications
• Development of behavioral and RTL models
• Development of testing ideology
• Support of foundry selection
• Synthesis of blocks
• Design of circuits and topology
• Verification of the project and HDL models
• Organization of manufacturing of ES, prototypes, pilot samples and a mass production
Engineering team
Developers of Technologies:
20 conducting developers with cumulative experience more than 600 years and having wide experience in development of platforms
• CMOS
• BiCMOS
• BCDMOS
• SOI-BCDMOS
• Trench CMOS, BiCMOS |
Developers of designs:
Having 15 years experiences of job with famous foundry factories.
Developing devices:
• Analog
• Digital
• Power (force) electronics
• Mixed - signal
• RF Analog and Digital
• Discrete devices |
Departments
>Design Laboratory which is developing
• Technologies
• Design Kits
• Chips and devices
>Assembly lines for discrete semiconductors
• Technologies of assembly of chips in cases 3-300pin
• Test-programms
• Test-equipment
>Wafer fabs with wide technology abilities
>Sales department
Technological platforms
• CMOS – 0.13-0.6um
• BiCMOS – 0.25-0.8um
• BCDMOS – 0.6-1.0um
• Trench CMOS – 0.25-0.55um
• Trench BiCMOS – 0.25-0.35
Products Range
Our semiconductor products cover
• Integrated circuits on base of technological platforms (BCDMOS,BiCMOS,CMOS – 0.13um-0.8um)
• discrete semiconductors on base of technological platforms (CMOS, trench CMOS, BiCMOS - 0.35um-1.5um. ) include IGBTs, MOSFETs, Ultrafast Diodes, Power Modules, etc...
Development
Power Semicondictors:
• MOSFETs
• IGBTs
• Shottky Diodes
• Ulatra Fast Diodes
• Drivers
• Power Modules |
Integrated Circuits:
• Microprocessors
• Gate Arrays
• Custom and Semi-Custom ICs
• Controllers
• DC/DC and AC/DC drivers
• LED drivers
• Converters |
Foundry Partnerships
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The general foundry partners
Wfab - CSMC and CSWC
• Assembly factories in China, Taiwan, Philippines
• Equipment Factories
Main types of designed products
• Power semiconductors
• Field-effect Transistors
• IGBT
• Drivers
• Integrated Circuits
• VLSI for Digital Signal Processing
• Microprocessors
• Gate Arrays
• Custom and semi-custom ICs
• Controller IC's
• Special Semiconductors
• VLSI for Analog/Digital Conversion
• VLSI for Digital/Analog Conversion
Processes specification
Core
process
name |
Options |
Design rules , um |
3 |
2 |
1.5 |
1 |
0.8 |
0.5/0.6 |
0.35 |
0.25 |
0.18 |
0.13 |
Digital
CMOS |
RF CMOS |
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| CMOS (with HV option) |
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| CMOS with EEPROM |
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| SOI-CMOS |
HV SOI CMOS |
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Digital-analog
BICMOS |
5V BiCMOS |
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| RF BiCMOS |
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Analog
bipolar |
40V bipolar |
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| 20V bipolar |
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| 40V trench isolation bipolar |
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Power
BCDMOS |
20V BCDMOS |
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| 80V BCDMOS |
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| 730V BCD |
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Notes:
 - realized projects
 - projects under development |
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